2888 active roles
Active roles over time
Daily opened vs closed
By department
All active roles
| Role | Dept | Location | Days open |
|---|---|---|---|
| FE CPIE PI Principal/Staff Engineer | — | Taichung - Fab 16, Taiwan | 167d |
| Engineer, Yield Enhancement | — | Fab 10N/X, Singapore | 72d |
| IT Field Service Technician | — | Boise, ID - ID1 | 50d |
| Staff Engineer, Design Verification | — | San Jose, CA | 167d |
| Process Integration Manager | — | Taichung - Fab 16, Taiwan | 127d |
| Staff Solutions Engineer, EHSS Solutions | — | Fab 10A, Singapore | 50d |
| F16 Metrology Application Engineer | — | Taichung - Fab 16, Taiwan | 127d |
| Test Solutions Engineer | — | MSB, Singapore | 48d |
| ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI) | — | MSB, Singapore | 48d |
| SR. AI Engineer | — | Taichung - AATT, Taiwan | 48d |
| Intern - ASIC Digital Design | — | Minneapolis, MN | 47d |
| SMAI Senior Data Scientist | — | Fab 10A, Singapore | 44d |
| MMTN AMHS Engineer | — | Tainan, Taiwan | 167d |
| Principal Engineer Photolithography DRAM Process Development (Evergreen) | — | Boise, ID - Main Site | 142d |
| Principal Engineer, Frontend Organizations Central Team, Dry Etch Process | — | Hiroshima - Fab 15, Japan | 139d |
| Engineer - QEM PQE Electrical Failure Analysis | — | Fab 10N/X, Singapore | 129d |
| Engineer - QEM PRODUCT QUALITY ENGINEERING YIELD | — | Fab 10N/X, Singapore | 129d |
| Senior Test Equipment Engineer | — | Penang, Malaysia - Grande | 44d |
| Staff AI Engineering | — | Boise, ID - Main Site | 41d |
| Product Development Engineer | — | Boise, ID - Main Site | 40d |
| Principal Memory Design Engineer, HBM | — | Richardson, TX | 111d |
| Staff Engineer - SSD Hardware Design | — | Bengaluru, India | 167d |
| MATERIAL ENGINEER, ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT | — | Taichung - Fab 16, Taiwan | 167d |
| Staff Engineer, Embedded Security, Firmware Development (SSD) | — | MSB, Singapore | 167d |
| Engineer, Metrology & Real Time Defects Analysis | — | Fab 10N/X, Singapore | 129d |
| Technologist - QEM Change Management | — | Fab 10N/X, Singapore | 167d |
| Engineering Project Manager - APTD Operations | — | Fab 10A, Singapore | 167d |
| Global Layout Snr/ Staff Engineer | — | Taichung - Fab 16, Taiwan | 98d |
| Staff Engineer, CE CAD | — | Boise, ID - Main Site | 98d |
| Sr / Staff Product Owner (I4.0 Analyst) - Smart Manufacturing & AI | — | Boise, ID - Main Site | 167d |
| Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory | — | Fab 10A, Singapore | 167d |
| Staff GenAI Engineer - AMS Design and Optimization | — | San Jose, CA | 97d |
| Senior/Staff Engineer, HIG-HBM Product Engineering (Media Health Manufacturing) | — | Fab 10A, Singapore | 167d |
| Sr Engineer, IT EIS Unix | — | Hyderabad - Phoenix Aquila, India | 167d |
| Senior Engineer - Area Manufacturing (PVD/CVD) | — | Boise, ID - Main Site | 76d |
| Financial Analyst ・ファイナンシャルアナリスト | — | Hiroshima - Fab 15, Japan | 76d |
| Veterans Hiring - Join Our Team at Micron | — | Hyderabad - Phoenix Aquila, India | 167d |
| IE AMHS 自動搬送設備管理・保全スタッフ（シフト勤務） | — | Hiroshima - Fab 15, Japan | 167d |
| ELV Technician | — | Sanand - MIB - Mini Pioneer, India | 167d |
| Technical specialist, OMT RDA-2 Operation_TC | — | Taichung - Fab 16, Taiwan | 164d |
| AI ENGINEER – SMART MFG (TECH SOLUTIONS) | — | Taichung - AATT, Taiwan | 71d |
| Manufacturing Technician | — | Fab 10N/X, Singapore | 71d |
| Data Science Manager | — | Taichung - AATT, Taiwan | 115d |
| HBM SoC Physical Design Engineer | — | Richardson, TX | 152d |
| Registered Apprenticeship, Facilities Water Service Technician | — | Boise, ID - Main Site | 152d |
| HVAC/R Operations Technician Job Description | — | Boise, ID - ID1 | 167d |
| Sr. Category Supplier Manager II, Facilities Procurement | — | Fab 10A, Singapore | 167d |
| Senior Facilities Gas Engineer | — | Manassas, VA - Fab 6 | 167d |
| Engineer - PIE YE | — | Fab 10N/X, Singapore | 167d |
| Staff Engineer, HIG HBM Layout | — | Hyderabad - Phoenix Aquila, India | 167d |
| SNR/STAFF SHIFT ENGINEER LEAD, TD MFG DEV ENGG | — | Fab 10N/X, Singapore | 152d |
| CMP Staff/Principal Engineer, Operation Central Team | — | Hiroshima - Fab 15, Japan | 148d |
| GLOBAL FE PLANNING MODELING ENGINEER | — | Taichung - Fab 16, Taiwan | 146d |
| Facility Digital System Engineer | — | Taichung - Fab 16, Taiwan | 108d |
| SR. ENGINEER - PD SG regE | — | Fab 10N/X, Singapore | 105d |
| Senior Photolithography Process Engineer | — | Boise, ID - ID1 | 167d |
| Senior Engineer, Global Facilities Central Engineering - I&C | — | Taoyuan - Fab 11, Taiwan | 94d |
| Engineer – 3D NAND Process Integration | — | Fab 10N/X, Singapore | 86d |
| Analog Design Engineer | — | Hyderabad - Phoenix Aquila, India | 167d |
| TECHNOLOGIST - PROBE EQUIPMENT | — | Fab 10A, Singapore | 167d |
| SR ENGINEER, FE CPIE RAM (RDA & METROLOGY) DETECTION Supplier Engagement | — | Fab 10A, Singapore | 86d |
| HBM Customer Systems Validation Engineer | — | Fab 10A, Singapore | 167d |
| Equipment Maintenance Technician | — | MSB, Singapore | 86d |
| Principal Engineer, NAND Advanced Thin Films Process Development | — | Fab 10N/X, Singapore | 167d |
| Intern - Process Development Engineer, 3D DRAM CMP | — | Boise, ID - Main Site | 86d |
| Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer/Senior Engineer | — | Taichung - Fab 16, Taiwan | 167d |
| Technician, Quality Management System (QMS) | — | MSB, Singapore | 167d |
| Staff Engineer, Water, Global Facilities | — | Hiroshima - Fab 15, Japan | 167d |
| Principal HBM Design Architect | — | Richardson, TX | 167d |
| Principal/Staff Engineer, FE OCT TIQ | — | Taoyuan - Fab 11, Taiwan | 127d |
| TVET/Certification Program | — | Penang, Malaysia - Grande | 167d |
| Principal Product Architect | — | Boise, ID - Main Site | 167d |
| Staff Engineer GFAC South Asia - Chemical | — | Fab 10A, Singapore | 167d |
| Engineer, Product & System Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory | — | Fab 10A, Singapore | 167d |
| Dry Etch Principal Engineer/ MTS Lead, Process Development, Advance NAND | — | Fab 10N/X, Singapore | 167d |
| Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing) | — | Fab 10A, Singapore | 167d |
| Firmware Engineer | — | MSB, Singapore | 167d |
| MTS ASIC Architect | — | Bengaluru, India | 149d |
| Principal Device Engineer | — | Taoyuan - Fab 11, Taiwan | 167d |
| MTS HIG-HBM-LAYOUT | — | Hyderabad - Phoenix Aquila, India | 149d |
| Principal/Senior Engineer, Dry Etch Tool Installation Qualification | — | Taichung - Fab 16, Taiwan | 167d |
| Staff/Senior Engineer, OCT MTE CC | — | Taichung - Fab 16, Taiwan | 149d |
| Realtime Defect Analysis Engineer | — | Boise, ID - Main Site | 167d |
| Senior Engineer, NAND Silicon Design Validation | — | MSB, Singapore | 167d |
| Senior Engineer, HIG HBM Package PE | — | Taichung - Fab 16, Taiwan | 80d |
| Staff Engineer - HBM Analog Design | — | Bengaluru, India | 100d |
| Planning Assistant | — | MSB, Singapore | 167d |
| Staff Engineer - HBM Analog Design | — | Bengaluru, India | 100d |
| Senior/Staff Engineer Central Process Quality Engineering Deviation Management Event Deviation | — | Hiroshima - Fab 15, Japan | 76d |
| Principal, Global Account Sales | — | Taipei - MTT office, Taiwan | 99d |
| Principal/MTS, Analog Design Engineering | — | Boise, ID - Main Site | 96d |
| OMT Planning Site Inventory Control (SIC) Engineer-Engineering-Taiwan | — | Taoyuan - Fab 11, Taiwan | 90d |
| Sr Advanced Packaging Technology Development Engineer, Bonding process | — | Taichung - Fab 16, Taiwan | 70d |
| Equipment Engineer – Mask Technology Center (MTC) | — | Boise, ID - Main Site | 64d |
| Principal, Semiconductor Product Eng Mgr | — | Boise, ID - Main Site | 61d |
| Semiconductor Design Engineer | — | Boise, ID - Main Site | 61d |
| Front End Central Product Integration Senior / Staff / Principal / Engineer, Test & Product Yield Integration | — | Hiroshima - Fab 15, Japan | 167d |
| TECHNICIAN, PROCESS AND EQUIPMENT (POST WAFER FABRICATION) | — | MSB, Singapore | 167d |
| SR AI ENGINEER, SMAI | — | Hyderabad - Phoenix Aquila, India | 59d |
| PRINCIPAL ENGINEER, AI ARCHITECT, SMAI | — | Hyderabad - Phoenix Aquila, India | 59d |
| Staff/Principal Engineer, Product Engineering | — | Hyderabad - Phoenix Aquila, India | 59d |
| PDE Post Electrical Equipment Engineer | — | Taichung - Fab 16, Taiwan | 59d |
| Global FG Capacity and Project Analyst | — | Greenwich, Singapore | 59d |
| Staff / Principal Engineer, Facilities Construction – I&C | — | Hiroshima - Fab 15, Japan | 167d |
| Staff / Principal Engineer, Facilities Construction – Water / UPW | — | Hiroshima - Fab 15, Japan | 167d |
| Staff / Principal Engineer, Facilities Construction – Gas & Chemical | — | Hiroshima - Fab 15, Japan | 167d |
| ENGINEER, EUV EQUIPMENT | — | Miaoli - Tongluo, Taiwan | 58d |
| Staff Engineer, ESSD Firmware Developer | — | Hyderabad - Phoenix Aquila, India | 58d |
| Staff Engineer, ESSD Firmware Developer | — | Bengaluru, India | 58d |
| Staff Engineer , ESSD Firmware | — | Bengaluru, India | 58d |
| HVM ME Shift Process Engineer | — | Boise, ID - ID1 | 50d |
| MGR, F16N DE FEOL PEE | — | Miaoli - Tongluo, Taiwan | 58d |
| MGR, F16N PHOTO TRACK PEE | — | Miaoli - Tongluo, Taiwan | 58d |
| SENIOR ASIC Engineer | — | Hsinchu - Chang Yih, Taiwan | 167d |
| New College Grad - Memory System Architect, HBM Generative AI | — | Folsom, CA | 47d |
| SR. DATA ENGINEER | — | Taoyuan - Fab 11, Taiwan | 167d |
| Manufacturing Equipment/Production Engineer | — | Fab 10N/X, Singapore | 129d |
| STAFF ENGINEER GFAC SASIA - ELECTRICAL | — | Fab 10A, Singapore | 97d |
| Jr/Sr IT Engineer - Data Services (Shift rotation) | — | Penang, Malaysia - Grande | 94d |
| Director, Taiwan Talent Acquisition | — | Taichung - Fab 16, Taiwan | 84d |
| SNR ENGINEER, FECOS CPIE STANDARDIZED | — | Taoyuan - Fab 11, Taiwan | 79d |
| SENIOR FACILITIES ENGINEER ,ELECTRICAL | — | Penang, Malaysia - Grande | 70d |
| Staff SailPoint Identity Security Cloud (ISC) Developer | — | Hyderabad - Phoenix Aquila, India | 48d |
| Engineer, Yield Enhancement PDE (Package Development Engineering) | — | MSB, Singapore | 48d |
| Senior/Staff Product Owner, SMART MFG & AI | — | Taichung - Fab 16, Taiwan | 48d |
| ENGINEER, HVM EQUIP PV EQ | — | Hiroshima - Fab 15, Japan | 167d |
| Sr. Executive IT Support Engineer | — | San Jose, CA | 47d |
| Senior Director, Technology Engineering & Innovation (TE&I) | — | Boise, ID - Main Site | 43d |
| Staff Memory Design Engineer, HBM | — | Richardson, TX | 42d |
| Package Design and Development Quality Assurance Engineer - Data Analytics | — | Boise, ID - Main Site | 42d |
| Sr AI Engineer, Platform | — | Boise, ID - Main Site | 40d |
| Fab6 ATE Process Integration Staff Engineer | — | Manassas, VA - Fab 6 | 37d |
| Engineer, Product & System Engineering (Media Health Manufacturing), Heterogenous Integration - High Bandwidth Memory | — | Fab 10A, Singapore | 167d |
| Sr. Engineer, CMP/Bond Equipment Development | — | Boise, ID - Main Site | 37d |
| Staff Engineer, SSD Hardware PCIE | — | Longmont-MAX- Office, CO | 37d |
| Principal / Senior/ Engineer, Package Characterization - APTD | — | Fab 10A, Singapore | 167d |
| Staff Specialist, EHSS Business Systems | — | Boise, ID - Main Site | 37d |
| Senior Engineer, Process Development, Wet, NTI | — | Fab 10N/X, Singapore | 167d |
| MGR, F16N HVM PROD SHIFT | — | Miaoli - Tongluo, Taiwan | 37d |
| Director, MSTI Safety | — | Sanand - 303A - AT/SSD/MOD, India | 37d |
| HBM ENGINEERING SUPPORT TECHNICIAN | — | Taichung - AATT, Taiwan | 37d |
| APTD Manufacturing Development Engineering Senior Manager | — | Taichung - Fab 16, Taiwan | 37d |
| Sr. Manager, Assembly Process Development (APTD) | — | Taichung - Fab 16, Taiwan | 37d |
| Principal HIG ESD and Latch-up Engineer- HBM - TPG | — | Hsinchu, Taiwan | 37d |
| Intern - ATE Process Engineer ID1 | — | Boise, ID - ID1 | 37d |
| Staff Engineer, Equipment Development, DIFI | — | Fab 10N/X, Singapore | 167d |
| Equipment Engineer (CMP) | — | Manassas, VA - Fab 6 | 37d |
| Principal Engineer, ASIC Physical Design | — | Hyderabad - Phoenix Aquila, India | 36d |
| ENGINEER, FST WH | — | Taichung - Fab 16, Taiwan | 36d |
| Engineer, SSD Validation | — | MSB, Singapore | 36d |
| SR EQUIPMENT ENGINEER (Tongluo) | — | Miaoli - Tongluo, Taiwan | 36d |
| logistics analyst 3 | — | MSB, Singapore | 36d |
| AMHS ENGINEER (TAINAN) | — | Tainan, Taiwan | 36d |
| AMHS ENGINEER (TAINAN) | — | Tainan, Taiwan | 36d |
| TEST SOLUTIONS ENGINEER | — | Taichung - Fab 16, Taiwan | 36d |
| PI3 Cell Engineer | — | Taichung - Fab 16, Taiwan | 36d |
| PI Engineer | — | Taichung - Fab 16, Taiwan | 36d |
| 即時缺陷分析測量機台設備工程師 | — | Taichung - Fab 16, Taiwan | 35d |
| Sr. Principal Venture Capital | — | San Jose, CA | 34d |
| Fab 10 DAST Production Control Technologist | — | Fab 10N/X, Singapore | 34d |
| Quality Technician (Audit) | — | MSB, Singapore | 167d |
| TECHNICIAN, ASSEMBLY | — | MSB, Singapore | 167d |
| Staff / Principal Engineer, Facilities Construction – CSA | — | Hiroshima - Fab 15, Japan | 167d |
| Senior Manager, Frontend Operations Central Team – Manufacturing Alignment Engineering | — | Hiroshima - Fab 15, Japan | 167d |
| SMTS/DMTS in Process Equipment Engineering | — | Taichung - Fab 16, Taiwan | 167d |
| QMS Engineer | — | Tainan, Taiwan | 164d |
| SHIFT ENGINEER, TD MFG DEV ENGG | — | Fab 10N/X, Singapore | 152d |
| Senior/Staff STPG Product Engineering - Probe | — | Fab 10N/X, Singapore | 129d |
| Principal Engineer – NAND Process Pathfinding – Dry Etch | — | Fab 10N/X, Singapore | 119d |
| Engineer, GQ OPS -REL Process | — | Sanand - 303A - AT/SSD/MOD, India | 116d |
| Principal Hardware Engineer, SSD | — | Boise, ID - Main Site | 113d |
| Module Planning Manager | — | Sanand - 303A - AT/SSD/MOD, India | 90d |
| SR ENGINEER, PRODUCT QE_PQA PTS/DPM | — | Taoyuan - Fab 11, Taiwan | 86d |
| Senior/Staff Engineer, Global Probe Modeling | — | Boise, ID - Main Site | 82d |
| Intern - Wet Etch Process Development Engineer | — | Boise, ID - Main Site | 80d |
| YE ENGINEER | — | Taichung - Fab 16, Taiwan | 80d |
| Senior Engineer ,DPG LPDDR Verification | — | Hyderabad - Phoenix Aquila, India | 51d |
| Staff/ Principal Engineer, OCT MTE Material Engineering | — | Fab 10A, Singapore | 80d |
| Senior Engineer, MCT Operations Quality | — | Taichung - MTB, Taiwan | 80d |
| AT Senior IP Security Engineer | — | Taichung - MTB, Taiwan | 80d |
| Intern 2027 - DRAM Customer Enablement Engineering | — | Taichung - Fab 16, Taiwan | 80d |
| HBM SoC RTL Design Engineer | — | Folsom, CA | 44d |
| Senior Energy and Decarbonization Engineer | — | Sanand - 303A - AT/SSD/MOD, India | 80d |
| Engineer, MRDA | — | Fab 10A, Singapore | 42d |
| PROCESS MANAGER DIFFUSION IMPLANT | — | Boise, ID - ID1 | 30d |
| Intern - SSD Architecture Modeling | — | Boise, ID - Main Site | 30d |
| Engineer, IT | — | Fab 10W, Singapore | 30d |
| IT Engineer (Data Services) | — | Fab 10W, Singapore | 30d |
| Intern - F10 HVM Photo PEE | — | Fab 10N/X, Singapore | 30d |
| Program Lead, Construction & Facilities | — | Sanand - 303C - Facilities/Construction, India | 30d |
| SR, Engineer - AMS Verification | — | Hyderabad - Phoenix Aquila, India | 30d |
| Test Engineering Manager | — | Sanand - 303A - AT/SSD/MOD, India | 30d |
| Global Engineering Lab (GEL) Equipment Maintenance Technician | — | Boise, ID - Main Site | 28d |
| Sr. Indirect Category Supplier Manager | — | Richardson, TX | 28d |
| TPM Engineer | — | Boise, ID - ID1 | 28d |
| Principal Engineer, HIG-HBM Design | — | Richardson, TX | 28d |
| PDK Enablement Engineer | — | Folsom, CA | 28d |
| Sr Indirect Category Supplier Manager II - Materials Category | — | Penang, Malaysia - Grande | 28d |
| Staff AI Engineer | — | Boise, ID - Main Site | 28d |
| Senior Design Engineer | — | San Jose, CA | 28d |
| Intern - IT Software Engineer | — | Boise, ID - Main Site | 27d |
| Principal PCIe Application Engineer | — | San Jose, CA | 27d |
| Staff Engineer, PD Adv NAND Dry Etch | — | Fab 10N/X, Singapore | 27d |
| AI Ops Solution Intake & Feasibility Analyst | — | Boise, ID - Main Site | 27d |
| PROCESS ETCH ENGINEER | — | Miaoli - Tongluo, Taiwan | 167d |
| TW ID1 RAM Operations Shift Engineer | — | Taoyuan - Fab 11, Taiwan | 167d |
| Senior I4.0 Product Owner | — | Taichung - Fab 16, Taiwan | 167d |
| Senior Manager - Process Development CMP/BTG, NAND | — | Fab 10N/X, Singapore | 146d |
| Senior Engineer, PD SG, Dry Etch, NAND | — | Fab 10N/X, Singapore | 137d |
| Smoke Testing AII | — | Manassas, VA - Fab 6 | 90d |
| Sales Development Representative 3 | — | Shenzhen, China | 63d |
| MSB PRODUCTION OPERATOR | — | MSB, Singapore | 57d |
| Senior/Staff Engineer, Global Environmental Technology | — | Boise, ID - Main Site | 56d |
| Sr Category Supplier Manager | — | Penang, Malaysia - Grande | 56d |
| Intern- Technician, Process | — | Boise, ID - ID1 | 53d |
| Manufacturing Applications Engineer | — | Boise, ID - ID1 | 53d |
| Facilities Life Safety Systems Engineer - Operations & Design | — | Boise, ID - Main Site | 52d |
| Facilities Engineer | — | Manassas, VA - Fab 6 | 52d |
| SR ENGINEER, FRONT END CENTRAL QUALITY ASSURANCE | — | Manassas, VA - Fab 6 | 52d |
| Sr Engineer, FE US Expansion Planning SIC | — | Boise, ID - Main Site | 52d |
| Engineer, Test Solutions | — | MSB, Singapore | 52d |
| Senior Emission Analyst | — | Taoyuan - Fab 11, Taiwan | 52d |
| Senior Business Intelligence Developer | Tableau/PowerBI & SQL | — | Hyderabad - Phoenix Aquila, India | 52d |
| Node Development Product Engineer | — | Taichung - Fab 16, Taiwan | 52d |
| Senior Process Integration Engineer | — | Boise, ID - ID1 | 51d |
| Principal Foundry Interface Design Engineer, HBM | — | Folsom, CA | 51d |
| Intern - Semiconductor Research & Technology Development | — | Albany, NY | 51d |
| NPO Supply Planner | — | Boise, ID - North Office | 51d |
| Staff Engineer, Metrology DRAM | — | Boise, ID - Main Site | 51d |
| Supply Chain Engineer | — | Boise, ID - North Office | 51d |
| Sr Engineer, Memory CAD, Guadalajara | — | Jalisco, Mexico | 167d |
| Intern - Data Center SSD Firmware | — | Longmont-MAX- Office, CO | 51d |
| DRAM Product Test Development Engineer | — | Taichung - Fab 16, Taiwan | 51d |
| INDIRECT CATEGORY SUPPLIER MANAGER | — | Taichung - Fab 16, Taiwan | 51d |
| Package Characterization Lab Manager, APTD | — | Fab 10A, Singapore | 167d |
| Principal Cybersecurity Domain Architect | — | Boise, ID - Main Site | 51d |
| NTI Process Integration Technical Specialist | — | Fab 10N/X, Singapore | 167d |
| PFA Senior Engineer | — | Taichung - Fab 16, Taiwan | 167d |
| Principal/Staff Engineer, PCVD Film Deposition, TD | — | Fab 10N/X, Singapore | 167d |
| Sr. Data Management Specialist | — | Hyderabad - Phoenix Aquila, India | 148d |
| Global Facilities Program Manager (PMO) | — | Fab 10A, Singapore | 167d |
| Photo MDE Principal Lead Engineer | — | Boise, ID - Main Site | 116d |
| ENGINEER, EUV EQUIPMENT | — | Taichung - Fab 16, Taiwan | 113d |
| Senior Engineer, Global Facilities US - I&C | — | Boise, ID - Main Site | 108d |
| Senior/Engineer, NAND Wafer Level Reliability & Design | — | Fab 10N/X, Singapore | 137d |
| Senior/ Staff Engineer, Front End Labor Productivity | — | Fab 10A, Singapore | 91d |
| Senior Engineer, MCT Operations Quality | — | MSB, Singapore | 91d |
| ID1 Part Type Owner (PTO) Engineer | — | Boise, ID - ID1 | 91d |
| Staff Engineer – HBM PE Component Validation (Singapore) | — | Fab 10A, Singapore | 91d |
| Mechanical Simulation Engineer – Advanced Packaging | — | Hyderabad - Phoenix Aquila, India | 91d |
| TW ID1 RAM Operations Shift Engineer | — | Taoyuan - Fab 11, Taiwan | 135d |
| Principal/Staff Engineer, Frontend Operations Central Team Materials Cost | — | Hiroshima - Fab 15, Japan | 91d |
| Engineer, TSE Equipment Integration | — | Tainan, Taiwan | 91d |
| Sr HBM Design Architect, PhD NCG | — | Richardson, TX | 90d |
| Senior/Staff Facilities SCADA Engineer | — | Boise, ID - Main Site | 135d |
| Principal Business Development Manager | — | San Jose, CA | 135d |
| Manager, ASIC DV | — | Hyderabad - Phoenix Aquila, India | 135d |
| Senior Engineer - HBM Design for Test (DFT) | — | Richardson, TX | 90d |
| Staff/ Senior Engineer, Firmware Test (SSD) | — | MSB, Singapore | 167d |
| Senior PCVD Equipment Engineer | — | Boise, ID - Main Site | 167d |
| Manager – NVMQRA | — | Longmont, CO | 167d |
| Senior Member of Technical Staff (SMTS) – Process Development, Thin Films (CVD/Diffusion), NAND | — | Fab 10N/X, Singapore | 167d |
| HBM SoC Physical Design Engineer | — | Richardson, TX | 167d |
| Senior Product Quality Engineer | — | Boise, ID - Main Site | 167d |
| Mixed Signal Design Engineer , HBM | — | Richardson, TX | 167d |
| Facilities Medium Voltage Electrical Maintenance Technician | — | Boise, ID - ID1 | 167d |
| Principal Process Engineer, Die Bonding | — | Boise, ID - Main Site | 167d |
| Senior Member of Technical Staff (SMTS) – Process Development, Photolithography, NAND | — | Fab 10N/X, Singapore | 167d |
| Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND | — | Fab 10N/X, Singapore | 167d |
| JR100843 Staff Engineer – Process Development, Wet, NAND | — | Fab 10N/X, Singapore | 167d |
| Distinguished Member of Technical Staff (DMTS) – Process Development, Wet, NAND | — | Fab 10N/X, Singapore | 167d |
| Staff Engineer Design | — | Hyderabad - Phoenix Aquila, India | 167d |
| TD Photolithography Automation Engineer | — | Boise, ID - Main Site | 167d |
| Staff HBM Design Architect - DFT | — | Richardson, TX | 167d |
| Facilities Engineer | — | Tainan, Taiwan | 167d |
| Construction Controls Manager | — | Hiroshima - Fab 15, Japan | 167d |
| MSSQL Database Engineer | — | Jalisco, Mexico | 167d |
| Senior Engineer, Process Development, Wet, NTI | — | Fab 10N/X, Singapore | 148d |
| Fab16 RDA Operation Engineer | — | Taichung - Fab 16, Taiwan | 126d |
| Engineer - QEM CC | — | Fab 10N/X, Singapore | 79d |
| Quality Technician | — | Fab 10N/X, Singapore | 71d |
| Sr. Principal, Corporate Business Development | — | Taipei - MTT office, Taiwan | 71d |
| PDE API PI, Engineer | — | Taichung - MTB, Taiwan | 56d |
| QDR Process Technician | — | Penang, Malaysia - Grande | 52d |
| Equipment Technician | — | Penang, Malaysia - Grande | 52d |
| Fire Alarm Technician | — | Boise, ID - ID1 | 50d |
| MTB Operations Intelligence Engineer (FY27 NCG) | — | Taichung - MTB, Taiwan | 50d |
| Engineer, Material | — | MSB, Singapore | 48d |
| SR. Sales Development Representative | — | Taipei - MTT office, Taiwan | 48d |
| QUALITY TECHNICIAN SPECIALIST | — | MSB, Singapore | 48d |
| Automated Material Handling System (AMHS) Equipment Maintenance Technician | — | Boise, ID - ID1 | 167d |
| Intern - Design Engineer, HBM | — | Richardson, TX | 44d |
| Staff Chemical Engineer | — | Clay, NY | 41d |
| New College Grad - HBM SoC Design Engineer/Architect | — | Folsom, CA | 37d |
| Analog Design Engineer, DMTS/SMTS/MTS | — | Hyderabad - Phoenix Aquila, India | 28d |
| Digital Circuit Design Engineer - DRAM Design | — | Boise, ID - Main Site | 27d |
| Staff Engineer, PD Adv NAND Photolithography | — | Fab 10N/X, Singapore | 27d |
| Staff Engineer - CMP Advanced NAND | — | Fab 10N/X, Singapore | 27d |
| Staff Engineer ,CVD ADV. NAND PD | — | Fab 10N/X, Singapore | 27d |
| Principal Engineer, PD Adv NAND Cell Film | — | Fab 10N/X, Singapore | 27d |
| Facility engineer | — | Taichung - MTB, Taiwan | 24d |
| GSC Workforce Development Specialist | — | Jalisco, Mexico | 23d |
| STAFF PRODUCT OWNER, INDIRECT COST | — | Fab 10A, Singapore | 22d |
| Construction ELV Staff / Senior Engineer | — | Fab 10N/X, Singapore | 17d |
| Construction Ultra Pure Water & Waste Water Treatment Staff / Senior Engineer | — | Fab 10N/X, Singapore | 17d |
| PMO Cost Engineer | — | Taichung - Fab 16, Taiwan | 167d |
| Senior Engineer, Global Facilities Electrical | — | Boise, ID - Main Site | 167d |
| Engineering Execution Manager, HIG High Bandwidth Memory (HBM) | — | Boise, ID - Main Site | 167d |
| New College Grad - HBM Layout Engineer | — | Jalisco, Mexico | 152d |
| PRINCIPAL ENGINEER - OCT FE PEE WET PROCESS | — | Fab 10A, Singapore | 128d |
| NTI Yield Analysis Engineer/Snr Engineer | — | Fab 10N/X, Singapore | 167d |
| ENGINEER - PLANNING IE | — | Fab 10N/X, Singapore | 115d |
| Customer Quality Engineer | — | Longmont-MAX- Office, CO | 16d |
| OMT HVM Equipment (SHIFT) Engineer (Tongluo) | — | Miaoli - Tongluo, Taiwan | 97d |
| MANAGER, DDEG DESIGN METHODOLOGY | — | Hyderabad - Phoenix Aquila, India | 167d |
| Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory | — | Fab 10A, Singapore | 167d |
| FACILITIES SPECIALIST, SITE SERVICES | — | Sanand - 303A - AT/SSD/MOD, India | 83d |
| Senior Engineer, FECOS cPIE Process Integration (Loop Integration) | — | Boise, ID - ID1 | 82d |
| AT Senior IP Security Engineer | — | Penang, Malaysia - Grande | 79d |
| SR ENGINEER/ENGINEER, STPG PE NAND | — | Penang, Malaysia - Grande | 78d |
| MGR, F16N TF_PVD PEE | — | Miaoli - Tongluo, Taiwan | 72d |
| 障がい者向け エンジニア 職（NAND設計職）*Disability | — | Tokyo, Japan | 65d |
| TSE KEG Equipment Engineer | — | Boise, ID - Main Site | 64d |
| NCG ENGINEER – HBM LAYOUT | — | Jalisco, Mexico | 15d |
| Staff Product Line Manager-NAND | — | San Jose, CA | 15d |
| EUV Lithography Process Development Engineer- TPG | — | Boise, ID - Main Site | 167d |
| Tool Install Electrical and Controls Engineer | — | Boise, ID - ID1 | 56d |
| Engineer/Senior Engineer, STPG PE (FDV-Infrastructure) | — | MSB, Singapore | 51d |
| Senior Engineer/Staff/Principal Engineer, CPIE RAM Detection Strategy | — | Boise, ID - ID1 | 167d |
| Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering | — | Fab 10A, Singapore | 51d |
| Senior/Staff Engineer, FE Labor Prod. & Data Engrg | — | Taoyuan - Fab 11, Taiwan | 167d |
| ENGINEER, OMT TECHNOLOGY PI3 NPI | — | Taichung - Fab 16, Taiwan | 47d |
| PRINCIPAL STRATEGY PROGRAM MANAGER – HIG HBM PSE | — | Fab 10A, Singapore | 41d |
| Senior/Staff NAND Design Rule Engineer | — | Hyderabad - Phoenix Aquila, India | 41d |
| DRAM Design Validation Engineer | — | Jalisco, Mexico | 41d |
| F10 Receiving and Shipping Specialist | — | Fab 10N/X, Singapore | 167d |
| Technician - F10 PEE ODT | — | Fab 10N/X, Singapore | 167d |
| Intern - Signal Integrity | — | Boise, ID - Main Site | 37d |
| Intern - DRAM ARCTITECHTURE | — | San Jose, CA | 35d |
| Staff DRAM Semiconductor Design Engineer | — | Jalisco, Mexico | 34d |
| Intern - SSD Firmware | — | Boise, ID - Main Site | 15d |
| SR ENGINEER, OMT ADT DE | — | Taichung - Fab 16, Taiwan | 29d |
| Assembly/Test Tactical Planner, ATTP | — | Sanand - 303A - AT/SSD/MOD, India | 29d |
| Senior Technician, MTB DRY ETCH | — | Taichung - MTB, Taiwan | 29d |
| Senior Manager, Global People Services & Solutions—Asia | — | Penang, Malaysia - Grande | 29d |
| Supply Manager, ATSM Capital | — | Penang, Malaysia - Grande | 29d |
| Sr Supply Manager II, ATSM Capital | — | Penang, Malaysia - Grande | 29d |
| Senior RDA Engineer, APTD | — | Boise, ID - Main Site | 167d |
| Design Engineer | — | Hyderabad - Phoenix Aquila, India | 167d |
| Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory | — | Fab 10A, Singapore | 29d |
| Senior NAND Applications Engineer | — | Hyderabad - Phoenix Aquila, India | 28d |
| Equipment & Spares Supplier Quality Manager | — | Taoyuan - Fab 11, Taiwan | 27d |
| Senior Engineer, PD Adv NAND Dry Etch | — | Fab 10N/X, Singapore | 27d |
| Sr Engineer, Process Development, Cell Film , Advance NAND | — | Fab 10N/X, Singapore | 27d |
| STAFF ENGINEER - CVD ADV. NAND PD | — | Fab 10N/X, Singapore | 27d |
| Front End Central Product Integration (FE cPIE) MTS (FE) | — | Taichung - Fab 16, Taiwan | 167d |
| MTB Assembly Equipment Engineer | — | Taichung - Fab 16, Taiwan | 24d |
| ENGINEER, MTB QE OPS | — | Taichung - MTB, Taiwan | 24d |
| Senior/Staff Engineer, Global Probe Operations | — | Fab 10A, Singapore | 14d |
| HBM PHOTO Equipment Engineer | — | Taichung - MTB, Taiwan | 24d |
| Metallization engineering lead | — | Tainan, Taiwan | 23d |
| Probe Equipment Shift Engineer | — | Tainan, Taiwan | 23d |
| Staff Engineer - Design Verification | — | Hyderabad - Phoenix Aquila, India | 167d |
| Facilities Electrical Engineer | — | Manassas, VA - Fab 6 | 22d |
| QE FDC ENGINEER | — | Taichung - Fab 16, Taiwan | 21d |
| Sr Manager Design Development Technical Leadership, HBM | — | Richardson, TX | 167d |
| DRAM Systems Architecture | — | Boise, ID - Main Site | 167d |
| SENIOR ENGINEER - HBM VERIFICATION | — | Jalisco, Mexico | 21d |
| Water Services PMO Coordinator | — | Boise, ID - Main Site | 21d |
| Program Manager | — | Manassas, VA - Fab 6 | 21d |
| MTS - HBM Thermal Integration Engineer | — | Richardson, TX | 20d |
| Technical Program Manager, Smart Manufacturing AI Pathfinding & Innovation (AIPI) | — | Boise, ID - Main Site | 20d |
| Sr. Principal, Corporate Business Development | — | San Jose, CA | 20d |
| Staff Engineer GFAC South Asia - Chemical | — | Fab 10A, Singapore | 167d |
| TECHNOLOGIST - F10 MFG EQUIPMENT | — | Fab 10N/X, Singapore | 167d |
| Manager, Electrical, Facilities Engineering | — | Fab 10N/X, Singapore | 167d |
| Semiconductor Principal Design Engineer, Non‑Volatile Engineering Group | — | Tokyo, Japan | 167d |
| Global Facilities Senior Program Manager (PMO) | — | Fab 10A, Singapore | 167d |
| Director, Construction Global Facilities North Asia | — | Hiroshima - Fab 15, Japan | 167d |
| Senior Manager, GPCOE AI Transformation | — | Hyderabad - Phoenix Aquila, India | 167d |
| Frontend Central Process Integration Senior Engineer | — | Boise, ID - ID1 | 167d |
| NTI Process Integration Technical Specialist | — | Fab 10N/X, Singapore | 167d |
| Manager, F16 DIFF/IMP OPERATION | — | Taichung - Fab 16, Taiwan | 167d |
| CMOS Device Integration Team - DMTS | — | Boise, ID - Main Site | 167d |
| TECHNOLOGIST - CHEMICAL LAB | — | Fab 10N/X, Singapore | 167d |
| HR Manager / Principal HR Business Partner, Hiroshima | — | Hiroshima - Fab 15, Japan | 167d |
| Front End Central Product Integration (FE cPIE) Senior Manager | — | Taichung - Fab 16, Taiwan | 167d |
| Signal Integrity Architect – System & IO Architecture | — | Boise, ID - Main Site | 167d |
| ENGINEER, HVM EQUIP PV EQ | — | Hiroshima - Fab 15, Japan | 167d |
| HVM Photo Scanner MTS | — | Taichung - Fab 16, Taiwan | 167d |
| SR ENGINEER, ASSEMBLY & TEST CENTRAL QA | — | Xian, China | 167d |
| HBM SOC Design Engineer | — | Richardson, TX | 167d |
| FE CPIE RDA Defect Engineering Snr Engineer/Principal Engineer | — | Taichung - Fab 16, Taiwan | 167d |
| Senior Member of Technical Staff, AI-optimized Memory SoC Microarchitect | — | Folsom, CA | 166d |
| ENGINEER/SENIOR, CE PRODUCT YIELD ENHANCEMENT | — | MSB, Singapore | 161d |
| Instrumentation & Controls Engineer, Global Facilities & Construction North Asia | — | Hiroshima - Fab 15, Japan | 167d |
| MTS, OMT Material & Process contamination control | — | Taoyuan - Fab 11, Taiwan | 167d |
| Veterans Hiring - Join Our Team at Micron Memory Malaysia | — | Penang, Malaysia - Grande | 167d |
| Micron Taiwan 二度就業徵才招募專區 (桃園/台中) | — | Taichung - Fab 16, Taiwan | 167d |
| Engineer, Fac Building Services Construction | — | Fab 10N/X, Singapore | 140d |
| SNR ENGINEER - FAC ELECTRICAL | — | Fab 10N/X, Singapore | 116d |
| Principal Design Engineer | — | San Jose, CA | 115d |
| Senior Engineer, HIG HBM Media Health | — | Taichung - Fab 16, Taiwan | 114d |
| Senior/Principal HBM Tapeout Execution & Release Coordination | — | Richardson, TX | 167d |
| Senior Engineer , Tool Install,Industrial Engineering | — | Sanand - 303A - AT/SSD/MOD, India | 78d |
| Senior Process Integration DRAM, PI Technician | — | Boise, ID - Main Site | 78d |
| Staff/Senior Engineer, PROCT FE Cost Excellence | — | Fab 10A, Singapore | 76d |
| Staff/Principal Engineer, NAND TD, RDA | — | Fab 10N/X, Singapore | 167d |
| Member of Technical Staff (MTS) – Process Development, Thin Films (CVD/Diffusion), NAND | — | Fab 10N/X, Singapore | 167d |
| MGR, OMT Fab Contamination Control Operation_TN | — | Tainan, Taiwan | 76d |
| Principal Engineer – Process Development, Wet, NAND | — | Fab 10N/X, Singapore | 167d |
| Sr. Process Integration Engineer - DRAM | — | Boise, ID - Main Site | 167d |
| Staff NAND Reliability Product Engineer | — | Fab 10N/X, Singapore | 167d |
| FE Central Product Integration Engineering (CPIE) Senior/ Staff Engineer | — | Taoyuan - Fab 11, Taiwan | 167d |
| Engineer, Firmware Development (SSD) | — | MSB, Singapore | 167d |
| Wet Process - Senior Engineer, Process Development SG, Advanced NAND | — | Fab 10N/X, Singapore | 167d |
| Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer/Senior Engineer | — | Boise, ID - ID1 | 167d |
| NTI Equipment Development Engineer, Real-Time Defect Analysis (RDA) | — | Fab 10N/X, Singapore | 167d |
| Gas Engineer, Global Facilities & Construction North Asia | — | Hiroshima - Fab 15, Japan | 167d |
| PRODUCT QE_PQA1 MRB | — | Taichung - Fab 16, Taiwan | 167d |
| Dry Etch Process Development Engineer | — | Boise, ID - Main Site | 167d |
| Central Planning Modeling Engineer | — | Taichung - Fab 16, Taiwan | 167d |
| Equipment Maintenance Technician (Idaho Fab 1) | — | Boise, ID - ID1 | 167d |
| STAFF ENGINEER - HIG HBM PSE | — | Fab 10A, Singapore | 167d |
| Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA) | — | Fab 10A, Singapore | 167d |
| Senior Wet Etch Equipment Engineer | — | Boise, ID - ID1 | 162d |
| PRINCIPAL ENGINEER, NAND PI | — | Fab 10N/X, Singapore | 161d |
| ENGINEER - F10 FAC CONTROL | — | Fab 10N/X, Singapore | 155d |
| Staff CAD Design Automation Engineer | — | Boise, ID - Main Site | 167d |
| Global Facilities Senior/Staff Engineer, Mechanical | — | Hiroshima - Fab 15, Japan | 167d |
| Senior Member of Technical Staff (SMTS) – Process Development, Cell Film, NAND | — | Fab 10N/X, Singapore | 167d |
| Principal NAND Reliability Product Engineer | — | Fab 10N/X, Singapore | 167d |
| Sr Dry Etch Equipment Engineer | — | Manassas, VA - Fab 6 | 167d |
| Facility 超純水/排水処理エンジニア 超純水/排水処理エンジニア | — | Hiroshima - Fab 15, Japan | 167d |
| Staff Engineer, Chemical, Global Facilities | — | Hiroshima - Fab 15, Japan | 167d |
| Engineer, HIG-HBM Product System & Engineering (Media Health Reliability) | — | Fab 10A, Singapore | 167d |
| Facilities Electrical Technician | — | Fab 10N/X, Singapore | 167d |
| Facilities Tool Install Technician | — | Fab 10N/X, Singapore | 167d |
| Embedded Software Lead | — | Boise, ID - SIG Building | 167d |
| 半導体製造 プローブ工程 装置保全スタッフ | — | Hiroshima - Fab 15, Japan | 167d |
| Senior Member of Technical Staff (SMTS), Process Development – Cell Film | — | Fab 10N/X, Singapore | 167d |
| Principal Engineer- DEG Layout | — | Bengaluru, India | 155d |
| Senior Diffusion Process Engineer | — | Boise, ID - ID1 | 154d |
| RDA.Metrology Equipment Maintenance Shift Engineer | — | Taichung - Fab 16, Taiwan | 135d |
| Design Manager, Global Facilities US | — | Boise, ID - Main Site | 128d |
| ENGINEER, NAND SILICON DESIGN VALIDATION | — | MSB, Singapore | 128d |
| Facilities Operation Manager | — | Sanand - 303C - Facilities/Construction, India | 134d |
| Process Integration & Yield Enhancement Engineer | — | Fab 10N/X, Singapore | 132d |
| Contamination Control and ESD Engineer | — | MSB, Singapore | 131d |
| Sr. DRAM System Engineer | — | Taichung - Fab 16, Taiwan | 128d |
| Principal Engineer - FPT Validation | — | Bengaluru, India | 126d |
| Senior Engineer, STPG PE (FDV-Verilog) | — | MSB, Singapore | 137d |
| Staff Engineer - PCB Design | — | Bengaluru, India | 126d |
| Test Engineer | — | Fab 10N/X, Singapore | 107d |
| QE PCM CH Engineer | — | Taoyuan - Fab 11, Taiwan | 107d |
| Principal Design Engineer - Sustaining, HBM | — | Richardson, TX | 167d |
| Staff Design Engineer - Sustaining, HBM | — | Richardson, TX | 167d |
| GQ Ops Process Technician | — | MSB, Singapore | 93d |
| FAB Engineer | — | Taichung - Fab 16, Taiwan | 92d |
| General Deposit - Engineer, Supervisor & Other Professionals | — | Penang, Malaysia - Grande | 84d |
| General Deposit - Technician, Admin & Other Non-Professionals | — | Penang, Malaysia - Grande | 84d |
| Sr Manager, FE OCT MAE | — | Fab 10A, Singapore | 84d |
| MTB INDUSTRIAL ENGINEER | — | Taichung - MTB, Taiwan | 83d |
| PI ENGINEER | — | Taoyuan - Fab 11, Taiwan | 83d |
| HBM Talent Pool – Engineering, Manufacturing & Facilities (HBM人才專區-台中后里) | — | Taichung - MTB, Taiwan | 167d |
| Staff Design Engineer, HBM | — | Richardson, TX | 82d |
| Staff ENGINEER - CE CAD | — | Richardson, TX | 167d |
| High NA EUV Track - Equipment Engineer | — | Remote | 167d |
| Staff SoC DFT Engineer, HBM | — | Richardson, TX | 167d |
| Principal Engineer- HIG HBM Layout | — | Hyderabad - Phoenix Aquila, India | 167d |
| High NA EUV - Scanner Engineer | — | Remote | 167d |
| Senior Engineer/Principal Engineer, CPIE RAM Detection Strategy | — | Boise, ID - ID1 | 167d |
| PRINCIPAL ENGINEER, SSD VALIDATION | — | MSB, Singapore | 167d |
| RDA Engineer, Advanced Packaging | — | Boise, ID - Main Site | 167d |
| Director, AI Enablement | — | Boise, ID - Main Site | 167d |
| Interconnect Model Development/Support CAD Staff Engineer/Senior Engineer | — | Hashimoto, Japan | 167d |
| Member Of Technical Staff - HBM Verification | — | Hyderabad - Phoenix Aquila, India | 167d |
| APAC Senior/Assistant General Counsel, Global Operations – Construction and Infrastructure | — | Taoyuan - Fab 11, Taiwan | 167d |
| Sr Process Integration Engineer, DRAM | — | Boise, ID - Main Site | 167d |
| Senior/Engineer, Metrology Process Development | — | Fab 10N/X, Singapore | 167d |
| Equipment Maintenance Technician | — | MSB, Singapore | 167d |
| Senior Data Scientist, SMAI | — | Fab 10A, Singapore | 167d |
| Principal, IO Design Engineering | — | Boise, ID - Main Site | 167d |
| RAM Applications Lead Engineer | — | Taichung - Fab 16, Taiwan | 132d |
| Senior Wet Etch Equipment Engineer | — | Boise, ID - ID1 | 167d |
| Principal Engineer, Firmware Security | — | San Jose, CA | 167d |
| Bulk Gas Operations Engineer | — | Syracuse, NY - Downtown Office | 167d |
| Member of Technical Staff (MTS) – Process Development, Dry Etch, NAND | — | Fab 10N/X, Singapore | 167d |
| 障がい者向け エンジニア 職(生産工学、生産施設、装置、プロセスエンジニア等）*Disability | — | Hiroshima - Fab 15, Japan | 167d |
| DRAM Design Tech Layout Engineer | — | Jalisco, Mexico | 167d |
| Senior Manager, MTE FE TIQ & Materials Cost | — | Taichung - Fab 16, Taiwan | 167d |
| CMP Process Engineer | — | Boise, ID - ID1 | 167d |
| New College Grad - OI System Engineer | — | Manassas, VA - Fab 6 | 167d |
| MSH PDE PI MANAGER | — | Fab 10A, Singapore | 150d |
| Engineer, Design | — | Avezzano (AQ), Italy | 148d |
| Staff Analyst - IT EA EPS | — | Hyderabad - Phoenix Aquila, India | 148d |
| Principal IT Informatica Architect | — | Boise, ID - Main Site | 142d |
| Senior DRAM Design Engineer | — | Boise, ID - Main Site | 142d |
| Facility Construction Project Engineer | — | Taichung - Fab 16, Taiwan | 167d |
| APAC Senior/Assistant General Counsel, Global Operations – Construction and Infrastructure | — | Fab 10A, Singapore | 167d |
| FE CPIE PI Principal/Staff Engineer | — | Boise, ID - ID1 | 167d |
| Total Productive Management Program Manager | — | Hiroshima - Fab 15, Japan | 167d |
| IE Layout - Space Modeling | — | Taichung - Fab 16, Taiwan | 167d |
| Senior / Staff Engineer, Front End Central Operations Strategy, Yield Enhancement | — | Hiroshima - Fab 15, Japan | 167d |
| 障がい者向け 半導体製造 工程管理スタッフ（シフト勤務） *Disability | — | Hiroshima - Fab 15, Japan | 167d |
| Product Yield Enhancement (PYE) Engineer | — | Boise, ID - Main Site | 167d |
| Films Process Development Engineer | — | Remote | 167d |
| SENIOR/ STAFF ENGINEER, FE OCT, MTE PAC | — | Fab 10A, Singapore | 167d |
| MTB PROCESS INTEGRATION ENGINEER | — | Taichung - MTB, Taiwan | 167d |
| Senior Financial Analyst I | — | Penang, Malaysia - Grande | 167d |
| Interface Design Architect, HBM - DMTS | — | Richardson, TX | 36d |
| Staff Engineer – Process Development, Photolithography, NAND | — | Fab 10N/X, Singapore | 167d |
| Principal/Staff ML/AI Engineer, Product Engineering, STPG | — | Fab 10N/X, Singapore | 167d |
| Senior Member of Technical Staff (SMTS) – Process Development, CMP, NAND | — | Fab 10N/X, Singapore | 167d |
| Engineer, HIG HBM Layout | — | Hyderabad - Phoenix Aquila, India | 167d |
| Senior Engineer – Process Development, Thin Films (CVD/Diffusion) NAND | — | Fab 10N/X, Singapore | 167d |
| Principal Engineer – Process Development, Dry Etch, NAND | — | Fab 10N/X, Singapore | 167d |
| Dry Etch Staff/Principal Engineer - Advanced NAND | — | Fab 10N/X, Singapore | 167d |
| Principal Engineer Advanced Package Technology Development | — | Boise, ID - Main Site | 167d |
| Electrical Engineer, Global Facilities & Construction North Asia | — | Taichung - Fab 16, Taiwan | 167d |
| Director, HVM EE DE/CB2 | — | Taichung - Fab 16, Taiwan | 47d |
| New College Grad - Engineer, Node Development PE | — | Boise, ID - Main Site | 44d |
| Sr. Director Semiconductor Sourcing and NPI Procurement | — | San Jose, CA | 44d |
| Engineer, Customer Validation, SSD | — | MSB, Singapore | 44d |
| Advanced CMOS Device & Process Integration Engineer | — | Hiroshima - Fab 15, Japan | 42d |
| Member of Technical Staff, NAND Advanced Thin Films Process Development | — | Fab 10N/X, Singapore | 167d |
| Staff STPG NAND Product Development Engineer | — | Fab 10N/X, Singapore | 41d |
| New College Grad - HBM Design Architect | MS or PhD | — | Richardson, TX | 40d |
| TECHNICIAN, TCP PROD. | — | Tainan, Taiwan | 108d |
| PI PTO Engineer | — | Boise, ID - ID1 | 37d |
| Layout/Mask Design Engineer | — | Boise, ID - Main Site | 37d |
| Design Lead (HBM/Advanced Memory Design) | — | Richardson, TX | 37d |
| 【美光 Micron 苗栗銅鑼廠｜熱烈招募中】 | — | Miaoli - Tongluo, Taiwan | 35d |
| Customer Technology & Solutions Architecture | — | Boise, ID - Main Site | 167d |
| Intern - Engineer, HIG HBM DTPCO | — | Richardson, TX | 30d |
| Construction Engineering Design Manager | — | Boise, ID - ID1 | 30d |
| OMT QE PQA SR MGR | — | Taichung - Fab 16, Taiwan | 106d |
| Sr MSTI Indirect Regional Supplier Manager | — | Sanand - 303A - AT/SSD/MOD, India | 106d |
| Intern - CMOS Process Integration | — | Boise, ID - ID1 | 30d |
| Intern - SMAI TD AI Engineering Team | — | Boise, ID - Main Site | 30d |
| Technologist - MFG WET | — | Fab 10N/X, Singapore | 105d |
| Global FE Materials Category Supplier Manager | — | Hiroshima - Fab 15, Japan | 29d |
| ファシリティ メカニカル テクニシャン / Facility Mechanical Technician | — | Hiroshima - Fab 15, Japan | 29d |
| Senior Engineer - HIG HBM PSE - Design Validation | — | Boise, ID - Main Site | 29d |
| TD Photolithography Automation Engineer | — | Albany, NY | 29d |
| Principal Engineer, Memory CAD Engineering | — | Richardson, TX | 29d |
| 【身心障礙人才招募專區】Micron Opportunities for Talents with Disabilities | — | Taichung - Fab 16, Taiwan | 29d |
| Metrology Engineer - DRAM | — | Boise, ID - Main Site | 167d |
| Wet Process DMTS/SMTS, Process Development SG, Advanced NAND | — | Fab 10N/X, Singapore | 167d |
| Senior Engineer, FW & Product Test Eng | — | Longmont-MAX- Office, CO | 28d |
| ASIC Design Engineer, DMTS/SMTS/MTS | — | Hyderabad - Phoenix Aquila, India | 28d |
| MTB Assembly Equipment Engineer | — | Taichung - Fab 16, Taiwan | 24d |
| Career Returnee | — | Penang, Malaysia - Grande | 167d |
| Sr. Engineer, AUTOMATION & APC PAE | — | Taichung - MTB, Taiwan | 24d |
| ENGINEER, MTB QE OPS | — | Taichung - MTB, Taiwan | 24d |
| Photolithography Engineer | — | Hyderabad - Phoenix Aquila, India | 24d |
| ENGINEER, MTB PWF WET PE | — | Taichung - MTB, Taiwan | 24d |
| ENGINEER, MTB PWF WET PE | — | Taichung - MTB, Taiwan | 24d |
| Engineer - PDE IOT Engineer | — | Taichung - MTB, Taiwan | 24d |
| HBM Bond Equipment Engineer | — | Taichung - MTB, Taiwan | 24d |
| HBM PHOTO Equipment Engineer | — | Taichung - MTB, Taiwan | 24d |
| PMO Taiwan Business Operation - Office Layout Planning Engineer | — | Taoyuan - Fab 11, Taiwan | 24d |
| Automated Materials Handling System (AMHS) Technician | — | Fab 10N/X, Singapore | 23d |
| ENGINEER, FECOS CPIE PI | — | Taichung - Fab 16, Taiwan | 167d |
| Intern - ID1 ATE PI Engineer | — | Boise, ID - ID1 | 23d |
| Senior Dry Etch Process Engineer | — | Boise, ID - ID1 | 167d |
| ENGINEER, DESIGN | — | Avezzano (AQ), Italy | 23d |
| HVM Production Supervisor (Tainan) | — | Tainan, Taiwan | 23d |
| Engineer, NVM QRA | — | Penang, Malaysia - Grande | 22d |
| Staff ESD/Latch-up Engineer, HBM Design Architecture Organization | — | Seoul, South Korea | 22d |
| Global Quality (GQ) – Quality Management Office (QMO) Enterprise Process Analyst | — | Taoyuan - Fab 11, Taiwan | 21d |
| TECHNICIAN, PROD. ( Tongluo) | — | Miaoli - Tongluo, Taiwan | 167d |
| Principal Engineer – Process Development, Photolithography, NAND | — | Fab 10N/X, Singapore | 167d |
| NY Construction- Cost Control Tax & Incentives | — | Clay, NY | 21d |
| Principal/Staff Process Integration Engineer, NAND Technology Integration | — | Fab 10N/X, Singapore | 20d |
| Engineer, IT | — | Fab 10W, Singapore | 20d |
| Engineer, Shift Process, Real Defect Analysis & Metrology | — | Fab 10N/X, Singapore | 167d |
| Sr. Engineer, Civil & Structure | — | Sanand - 303C - Facilities/Construction, India | 20d |
| Senior Engineer, Edge Systems Architecture | — | Hyderabad - Phoenix Aquila, India | 20d |
| New College Grad - Computer Engineer, Central Engineering | — | Boise, ID - Main Site | 20d |
| MGR, F11 TPM | — | Taoyuan - Fab 11, Taiwan | 167d |
| Sr Engineer, TSE-DRAM | — | Boise, ID - Main Site | 20d |
| Senior Engineer ASIC DV | — | Hyderabad - Phoenix Aquila, India | 20d |
| Senior Engineer, Edge Systems Architecture | — | Hyderabad - Phoenix Aquila, India | 20d |
| STPG Product Engineering Industrial Engineer | — | Fab 10N/X, Singapore | 20d |
| Assembly Equipment Engineer | — | Taichung - MTB, Taiwan | 17d |
| Gas and Chemical Systems Technician | — | Boise, ID - Main Site | 15d |
| Principal Technical Product Manager | — | Folsom, CA | 15d |
| Senior Photolithography Equipment Engineer | — | Boise, ID - ID1 | 167d |
| Senior Process Engineering Technical Leader | — | Boise, ID - Main Site | 167d |
| Intern - SMAI Probe AI Engineer | — | Boise, ID - Main Site | 15d |
| Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal) | — | Boise, ID - ID1 | 167d |
| New College Grad - Dry Etch Process Engineer | — | Boise, ID - Main Site | 15d |
| Staff Product Line Manager | — | Folsom, CA | 14d |
| Principal Engineer, ASIC Validation | — | Hyderabad - Phoenix Aquila, India | 14d |
| Sr Engineer, ASIC Validation | — | Hyderabad - Phoenix Aquila, India | 14d |
| Equipment Engineer - Yield Technology | — | Boise, ID - Main Site | 167d |
| Principal Product Line Manager | — | Folsom, CA | 14d |
| Staff Engineer | — | Boise, ID - Main Site | 14d |
| PCVD Process Engineer | — | Boise, ID - Main Site | 14d |
| ENGINEER, CE PYE | — | MSB, Singapore | 14d |
| ENGINEER, CE PYE | — | MSB, Singapore | 14d |
| Director, OEM Major Compute & Infrastructure Accounts | — | Austin, TX | 14d |
| Staff Engineer, ASIC Validation | — | Hyderabad - Phoenix Aquila, India | 142d |
| Intern - PEE DIFFUSION | — | Fab 10N/X, Singapore | 122d |
| Intern – Business Process Analyst | — | Boise, ID - Main Site | 13d |
| ENGINEER - PD SG CMP | — | Fab 10N/X, Singapore | 119d |
| Engineer - Planning (Materials and Spares Planning) | — | Fab 10N/X, Singapore | 115d |
| DRAM Principal Design Verification Engineer | — | Boise, ID - Main Site | 12d |
| SR ATSM NETWORK SUPPLY MANAGER II | — | MSB, Singapore | 10d |
| Advanced CMOS Device & Process Integration Engineer | — | Hiroshima - Fab 15, Japan | 167d |
| Senior Engineer, DRAM PATHFINDING PI | — | Hiroshima - Fab 15, Japan | 142d |
| Wet Process Engineer | — | Boise, ID - ID1 | 110d |
| SEMシフトテクニシャン DRAM 次世代開発 Yield Enhancementチーム | — | Hiroshima - Fab 15, Japan | 10d |
| FECOS Inventory Control - HVM/NPI Senior Manager | — | Fab 10A, Singapore | 10d |
| Sr AI Engineer, SMAI | — | Fab 10W, Singapore | 10d |
| Quality and Reliability Assurance Technician (NVM) | — | Sanand - 303A - AT/SSD/MOD, India | 10d |
| FACILITIES ENGINEER - ELECTRICAL | — | Fab 10N/X, Singapore | 72d |
| New College Grad - ENGINEER, SIG ELECTRICAL DESIGN | — | Boise, ID - SIG Building | 71d |
| Design Methodology – Principal DRAM Power Integrity Engineer | — | Hyderabad - Phoenix Aquila, India | 167d |
| Senior Engineer, FE Central QA | — | Boise, ID - ID1 | 8d |
| Senior Engineer, PD, CVD/Diffusion | — | Fab 10N/X, Singapore | 167d |
| Principal/Staff Process Integration Engineer | — | Hiroshima - Fab 15, Japan | 167d |
| Design Verification Engineer | — | Hyderabad - Phoenix Aquila, India | 167d |
| Staff Product Owner, Industrial & Physical AI, SMAI | — | Fab 10A, Singapore | 107d |
| Sr Design Engineer, DEG Design Method | — | Boise, ID - Main Site | 107d |
| Night Shift Process Engineer - Thin Films | — | Manassas, VA - Fab 6 | 8d |
| Implant Equipment Engineer | — | Boise, ID - ID1 | 105d |
| Semiconductor Equipment Applications Eng | — | Boise, ID - Main Site | 105d |
| Senior/Principal NAND Device Engineer | — | Fab 10N/X, Singapore | 105d |
| Intern - Strategic Category Analyst | — | Boise, ID - North Office | 8d |
| Technologist - PEE Fab Support | — | Fab 10N/X, Singapore | 65d |
| PRINCIPAL ENGINEER, SSD VALIDATION | — | MSB, Singapore | 167d |
| Intern - DRAM Process Integration | — | Boise, ID - Main Site | 65d |
| Senior Engineer - Firmware Development (SSD) | — | MSB, Singapore | 103d |
| Senior Principal Engineer – ASIC Silicon Debug, Device Technology & Yield Engineering | — | Hsinchu, Taiwan | 101d |
| Principal Technical Product Manager | — | Folsom, CA | 65d |
| Staff Engineer - HBM Analog Design | — | Bengaluru, India | 100d |
| Senior Engineer, Unit Process Modeling | — | Hyderabad - Phoenix Aquila, India | 99d |
| NAND Designer / Layout | — | Tokyo, Japan | 8d |
| TECHNOLOGIST - FAC UPW & WWTP | — | Fab 10A, Singapore | 167d |
| Staff SSD Firmware Test Engineer | — | Longmont-MAX- Office, CO | 99d |
| NAND Designer / Layout | — | Tokyo, Japan | 8d |
| Senior Engineer - Electrical Failure Analysis, NTI | — | Fab 10N/X, Singapore | 8d |
| Intern – CMBU Product Management | — | San Jose, CA | 8d |
| Sr Engineer, MDS Support | — | Hyderabad - Phoenix Aquila, India | 8d |
| FE OCT CPEE Films DMTS | — | Boise, ID - North Office | 8d |
| ATE Process Engineer | — | Boise, ID - ID1 | 8d |
| SENIOR ENGINEER HBM LAYOUT | — | Jalisco, Mexico | 8d |
| SENIOR ENGINEER HBM LAYOUT | — | Jalisco, Mexico | 8d |
| SENIOR ENGINEER HBM LAYOUT | — | Jalisco, Mexico | 8d |
| Global Facilities Project Manager, Construction & Project Management, South Asia | — | Fab 10A, Singapore | 94d |
| FAB Engineer | — | Syracuse, NY - Downtown Office | 8d |
| SENIOR ENGINEER, ID1 ATE - WP PROCESS | — | Boise, ID - ID1 | 8d |
| Engineer, US Expansion Planning | — | Boise, ID - Main Site | 8d |
| Intern - Product Yield Software Engineer | — | Boise, ID - Main Site | 8d |
| PI Engineer | — | Miaoli - Tongluo, Taiwan | 8d |
| New College Grad - Mixed Signal Design Engineer, HBM | — | Richardson, TX | 64d |
| Senior HBM Architecture & Circuit Design Engineer | — | Richardson, TX | 8d |
| Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Reliability Coding) | — | Fab 10A, Singapore | 167d |
| Principal HBM Architecture & Circuit Design Engineer | — | Richardson, TX | 8d |
| Safety Engineer | — | Boise, ID - ID1 | 64d |
| Intern - EUV Lithography | — | Boise, ID - Main Site | 64d |
| Senior Manager, Sales & Operations Planning | — | Boise, ID - North Office | 64d |
| Intern - Product Test Development Engineer | — | Boise, ID - Main Site | 8d |
| Senior Engineer, DPG LPDDR Verification | — | Hyderabad - Phoenix Aquila, India | 8d |
| Engineer, WH | — | Miaoli - Tongluo, Taiwan | 8d |
| PRINCIPAL ENGINEER, ASIC DESIGN | — | Hyderabad - Phoenix Aquila, India | 8d |
| PRINCIPAL ENGINEER, ASIC DESIGN | — | Hyderabad - Phoenix Aquila, India | 8d |
| Engineer - Process Control System | — | Fab 10A, Singapore | 8d |
| Engineer, PDE CEM | — | Sanand - 303A - AT/SSD/MOD, India | 8d |
| Staff Engineer, SSD Systems Design | — | Longmont-MAX- Office, CO | 8d |
| Staff Engineer - IT EA ERP | — | Hyderabad - Phoenix Aquila, India | 8d |
| Staff SAP RAP Developer | — | Hyderabad - Phoenix Aquila, India | 8d |
| Senior Business Analyst | — | MSB, Singapore | 8d |
| Engineer, Automation Integration | — | MSB, Singapore | 8d |
| Technologist - QEM Change Management | — | Fab 10N/X, Singapore | 167d |
| Regional Governance, Risk, Compliance Principal | — | Hiroshima - Fab 15, Japan | 93d |
| QE PCT Engineer | — | Taichung - Fab 16, Taiwan | 167d |
| Lead - Smart Systems & OI | — | Sanand - 303A - AT/SSD/MOD, India | 8d |
| Intern - Advanced DRAM Cell & Device Technology | — | Boise, ID - Main Site | 63d |
| TF Section Manager/Engineer Lead | — | Taichung - Fab 16, Taiwan | 8d |
| Diffusion Equipment Engineer | — | Boise, ID - Main Site | 167d |
| Staff / Principal Engineer, Facilities Construction – Electrical | — | Hiroshima - Fab 15, Japan | 167d |
| Probe Production Technician | — | Hiroshima - Fab 15, Japan | 8d |
| Test Electrical Failure Analysis (EFA) Technician | — | Penang, Malaysia - Grande | 8d |
| Intern - TSE SSD TE | — | Penang, Malaysia - Grande | 8d |
| Senior Data Scientist | — | MSB, Singapore | 8d |
| Lead Business Process Analyst | — | Richardson, TX | 8d |
| Principal Architect, IT Procurement | — | Boise, ID - Main Site | 8d |
| Semiconductor Equipment Engineer (Equipment Owner) | — | Manassas, VA - Fab 6 | 167d |
| Process Control Systems Engineer | — | Manassas, VA - Fab 6 | 8d |
| Photolithography Process Development Engineer | — | Boise, ID - Main Site | 167d |
| Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability) | — | Fab 10A, Singapore | 92d |
| Staff/Senior Engineer, PROCT FE Cost Excellence | — | Taichung - Fab 16, Taiwan | 167d |
| STAFF/SENIOR ENGINEER, FE OCT, MTE PAC | — | Taichung - Fab 16, Taiwan | 167d |
| Photolithography Advanced DRAM Process Development | — | Boise, ID - Main Site | 92d |
| Intern - Process Pathfinding, DRAM Dry Etch | — | Boise, ID - Main Site | 92d |
| Global Quality FrontEnd Central Quality Assurance Remote Operation Control Engineer | — | Hyderabad - Phoenix Aquila, India | 92d |
| Senior Engineer, Process Integration, Advanced NAND | — | Fab 10N/X, Singapore | 167d |
| SMTS/DMTS in Process Engineering | — | Taichung - Fab 16, Taiwan | 167d |
| MTS, IE AMHS | — | Taichung - Fab 16, Taiwan | 167d |
| SMTS Product Architect | — | Boise, ID - Main Site | 167d |
| NAND Cell Device Senior/Principle Engineer | — | Fab 10N/X, Singapore | 167d |
| Senior Engineer, CAD | — | Hyderabad - Phoenix Aquila, India | 167d |
| Staff Engineer Design | — | Hyderabad - Phoenix Aquila, India | 167d |
| Principal Corporate Narrative & Messaging Lead | — | San Jose, CA | 167d |
| ENGINEER - FACILITIES CHEMICAL AND GAS | — | Fab 10A, Singapore | 167d |
| SMTS, NAND PI | — | Fab 10N/X, Singapore | 161d |
| Senior/Principal Eng, FE OCT CPEE Photo EUV Track, Material & Cost Excellence | — | Boise, ID - ID1 | 149d |
| Principal Engineer Track and Trim Equipment Engiineer | — | Boise, ID - Main Site | 149d |
| Staff I4.0 Product Owner | — | MSB, Singapore | 139d |
| Global Document Control & PMIS Governance Lead | — | Boise, ID - Main Site | 138d |
| ENGINEER, OMT HVM EE-DE/CVD/PVD | — | Taichung - Fab 16, Taiwan | 167d |
| SMTS Diffusion & Thin Films | — | Miaoli - Tongluo, Taiwan | 167d |
| Principal Engineer, Firmware & Product Test | — | Longmont, CO | 126d |
| Fronted End Central Process Integration Engineer/Senior Engineer | — | Fab 10A, Singapore | 125d |
| QE PQI ENGINEER | — | Taoyuan - Fab 11, Taiwan | 121d |
| SENIOR ENG-HIG-HBM-LAYOUT | — | Hyderabad - Phoenix Aquila, India | 115d |
| STAFF/SENIOR/ENGINEER, PRODUCT YIELD ENHANCEMENT (PYE) | — | MSB, Singapore | 115d |
| Senior / Staff Probe Card Engineer | — | Boise, ID - Main Site | 162d |
| MANAGER, DATA ENGINEERING, SMAI | — | Hyderabad - Phoenix Aquila, India | 111d |
| Director, Sales Strategy and Planning | — | San Jose, CA | 108d |
| Engineer- DRAM, Advanced DRAM and EM Device/Cell Technology | — | Boise, ID - Main Site | 167d |
| OCT PCVD Mfg. Alignment (MA) Sr Engineer/Principal Engineer | — | Fab 10A, Singapore | 167d |
| LPDDR Layout Design Engineer | — | Hashimoto, Japan | 167d |
| TECHNOLOGIST - FAB LAYOUT PLANNING | — | MSB, Singapore | 167d |
| HBM 輪班設備工程師 HBM Shift Equipment Engineer | — | Taichung - MTB, Taiwan | 167d |
| Principal Design Engineer, DRAM | — | Boise, ID - Main Site | 149d |
| Principal SSD Systems Design Engineer | — | Longmont, CO | 135d |
| Automation Engineer | — | MSB, Singapore | 167d |
| SR. I4.0 ANALYST, SMAI OI | — | Taichung - Fab 16, Taiwan | 167d |
| Sr Category Supplier Manager II, TD Procurement Die Level Packaging | — | Taichung - MTB, Taiwan | 99d |
| MTS, HIG-HBM Layout | — | Hyderabad - Phoenix Aquila, India | 167d |
| OMT TECHNOLOGY DEVICE and PI | — | Taichung - Fab 16, Taiwan | 98d |
| Principal Engineer – Process Development, Cell Film, NAND | — | Fab 10N/X, Singapore | 167d |
| MTS - ESD Design Engineer | — | Bengaluru, India | 167d |
| Dry Etch - SMTS, PD, Advance NAND | — | Fab 10N/X, Singapore | 167d |
| Principal HBM Design Architect | — | Richardson, TX | 167d |
| HVM PEE Dry Etch MTS/SMTS | — | Taichung - Fab 16, Taiwan | 167d |
| RDA and Metrology Central Team Engineer | — | Hiroshima - Fab 15, Japan | 167d |
| Module Quality Engineer | — | Xian, China | 167d |
| SNR ENGINEER, PD SG CMP | — | Fab 10N/X, Singapore | 96d |
| Principal Engineer, ASIC Analog Design | — | Bengaluru, India | 96d |
| Principal Engineer - Memory Circuit Design Verification | — | Hyderabad - Phoenix Aquila, India | 153d |
| Water Senior/Staff Engineer, Global Facilities, North Asia | — | Taichung - Fab 16, Taiwan | 94d |
| SR ENGINEER ,IT EA PLM | — | Hyderabad - Phoenix Aquila, India | 167d |
| Senior / Principal DRAM Product Development Engineer – DEG Technology | — | Boise, ID - Main Site | 167d |
| ENGINEER, OMT HVM PROD.(Tongluo) | — | Miaoli - Tongluo, Taiwan | 167d |
| Sr/Staff Design Verification Engineer, HBM Verification Architecture | — | Richardson, TX | 167d |
| New College Grad - Memory Design Engineer, HBM | — | Richardson, TX | 167d |
| Sr Product Owner, SMART MFG & AI | — | Hiroshima - Fab 15, Japan | 167d |
| Sr/Staff/Principal Engineer, Facilities/Construction | — | Taichung - Fab 16, Taiwan | 167d |
| Manufacturing Equipment/Production Engineer | — | Fab 10N/X, Singapore | 167d |
| Staff/Senior Engineer CE PYE (Physical Failure Analysis/Fault Isolation) | — | MSB, Singapore | 167d |
| EDE Equipment Development Engineer - PCVD | — | Fab 10N/X, Singapore | 153d |
| SR ENGINEER, APTD Dry Etch Process | — | Taichung - Fab 16, Taiwan | 149d |
| MTS, Analog Design Engineering | — | Boise, ID - Main Site | 139d |
| SR ATSM PROC OPS MANAGER II, OSAT | — | Taichung - Fab 16, Taiwan | 114d |
| Technologist - F10 Manufacturing Shift Production | — | Fab 10N/X, Singapore | 167d |
| TD CVD/DIFF/IMPLANT Process MDE Manager (Process Development Support) | — | Boise, ID - Main Site | 116d |
| TECH SPEC- FAC Tool Install | — | Fab 10A, Singapore | 94d |
| MTS, AI Optimized Memory Digital Design Engineer | — | Folsom, CA | 92d |
| Facilities Instrumentation & Controls Technician - Water | — | Boise, ID - ID1 | 116d |
| Senior/ Staff Engineer, Firmware Test (SSD) | — | MSB, Singapore | 167d |
| Staff/ Principa/ MTS Agentic AI Architect – Knowledge Engineering | — | Hyderabad - Phoenix Aquila, India | 79d |
| Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer/Senior Engineer | — | Fab 10A, Singapore | 167d |
| Staff Data Center Campaign Lead | — | Boise, ID - Main Site | 116d |
| Construction Mechanical Engineer | — | Hiroshima - Fab 15, Japan | 73d |
| Chemical Senior/Staff Engineer, Global Facilities, North Asia | — | Hiroshima - Fab 15, Japan | 167d |
| Senior Memory circuit design verification engineer | — | Hyderabad - Phoenix Aquila, India | 167d |
| Full-Stack AI Engineer, IPAI, SMAI | — | Fab 10A, Singapore | 114d |
| Industrial Engineer | — | Taichung - Fab 16, Taiwan | 167d |
| Principal Analog Design Engineer | — | Boise, ID - Main Site | 114d |
| Soft Services Manager | — | Sanand - 303A - AT/SSD/MOD, India | 113d |
| Staff Engineer, SSD Validation | — | Longmont-MAX- Office, CO | 70d |
| New College Grad - Product Test Engineer | — | Boise, ID - Main Site | 66d |
| SR DATA SCIENTIST, SMAI OI | — | Taoyuan - Fab 11, Taiwan | 167d |
| Sr. Manager - PQA MOD/SSD | — | Sanand - 303A - AT/SSD/MOD, India | 59d |
| OMT Bench Technician | — | Tainan, Taiwan | 57d |
| PHOTO TRACK Process Engineer | — | Miaoli - Tongluo, Taiwan | 57d |
| Senior/Principal Eng, FE OCT CPEE PHOTO EUV/DUV PROCESS | — | Taichung - Fab 16, Taiwan | 57d |
| Intern - ASIC Validation | — | Minneapolis, MN | 51d |
| 晶圓廠設備工程師 Fab Equipment Engineer | — | Miaoli - Tongluo, Taiwan | 51d |
| Intern – NAND Intrinsic Reliability & Data Analytics | — | Penang, Malaysia - Grande | 51d |
| Staff AMS Layout engineer-DPG-LPDDR | — | Hyderabad - Phoenix Aquila, India | 112d |
| ServiceNow Engineer - ESG, Health & Safety | — | Hyderabad - Phoenix Aquila, India | 51d |
| Staff HIG ESD and Latch-up Engineer- HBM - TPG | — | Folsom, CA | 50d |
| MTB Industrial Engineer | — | Taichung - MTB, Taiwan | 50d |
| HBM MFG Production Engineer | — | Taichung - MTB, Taiwan | 50d |
| AI Reimagination Engineer | — | Hyderabad - Phoenix Aquila, India | 50d |
| Staff Specialist, EHSS Data | — | Fab 10A, Singapore | 50d |
| Yield Analysis Engineer | — | Taichung - Fab 16, Taiwan | 50d |
| New College Grad - Engineer, ASIC Digital Design | — | Minneapolis, MN | 48d |
| Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Manufacturing) | — | Fab 10A, Singapore | 167d |
| ENGINEER, SIG ELECTRICAL DESIGN | — | Hyderabad - Phoenix Aquila, India | 48d |
| Supply Chain Planner | — | Jalisco, Mexico | 48d |
| Superintendent | — | Manassas, VA - Fab 6 | 48d |
| NTI Physical Failure Analysis Technician | — | Fab 10N/X, Singapore | 48d |
| Staff Engineer, FE OCT CPEE HVM DRY ETCH | — | Fab 10A, Singapore | 44d |
| PMO TBO - Office Layout Planning | — | Taichung - Fab 16, Taiwan | 44d |
| Intern – DRAM Technology Physical Design and Block-Level PPA Optimization | — | Boise, ID - Main Site | 44d |
| HVM PEE WP PR ENG | — | Hiroshima - Fab 15, Japan | 167d |
| PRINCIPAL ENGINEER, CONTROLLER QUALITY | — | San Jose, CA | 44d |
| Principal Engineer - HIG Component Validation | — | Boise, ID - Main Site | 43d |
| Sr. Observability Engineer | — | Hyderabad - Phoenix Aquila, India | 167d |
| Intern - Facilities Sustainability AI | — | MSB, Singapore | 43d |
| Intern - Assembly NPI | — | MSB, Singapore | 43d |
| Principal Signal Integrity Engineer, Pathfinding | — | Boise, ID - Main Site | 43d |
| HBM Advanced Package Sr. Process / Equipment Engineer | — | Taichung - MTB, Taiwan | 43d |
| Principal Engineer – 3D NAND Process Integration | — | Fab 10N/X, Singapore | 43d |
| Intern - ADTS ATI PI | — | Fab 10N/X, Singapore | 43d |
| OMT Equipment (SHIFT) Engineer | — | Tainan, Taiwan | 42d |
| Intern - MSB Automation Engineer | — | MSB, Singapore | 42d |
| Logistics Analyst | — | MSB, Singapore | 42d |
| IT Project Manager | — | Hyderabad - Phoenix Aquila, India | 42d |
| Staff Engineer, ASIC STA | — | Bengaluru, India | 42d |
| Engineering Excellence Engineer 2 | — | Taichung - MTB, Taiwan | 42d |
| Senior/Staff Engineer CPQE Deviation Management | — | Hiroshima - Fab 15, Japan | 42d |
| CMP工程シフトエンジニア（製造開発エンジニアリング／シフト勤務）‐ CMP Shift Engineer, Manufacturing Development Engineering | — | Hiroshima - Fab 15, Japan | 42d |
| Sr Design Automation Engineer, Simulation | — | Boise, ID - Main Site | 42d |
| Intern Design Engineer - HIG HBM | — | Richardson, TX | 42d |
| Sr. Director, Business Development - Cloud Memory | — | San Jose, CA | 42d |
| Staff/Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM | — | Fab 10A, Singapore | 42d |
| SR ATSM NETWORK SUPPLY MANAGER II | — | MSB, Singapore | 41d |
| Global Quality FrontEnd Central Quality Assurance Engineer | — | Hyderabad - Phoenix Aquila, India | 41d |
| Senior High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer | — | Fab 10A, Singapore | 41d |
| Staff Process Engineer, Advanced Packaging CMP | — | Boise, ID - Main Site | 41d |
| Director, Technology Engineering & Innovation (TE&I) – India | — | Hyderabad - Phoenix Aquila, India | 41d |
| Technician, Process Control Systems (PCS) | — | MSB, Singapore | 41d |
| AI Full Stack Senior Engineer | — | Taoyuan - Fab 11, Taiwan | 120d |
| Principal Engineer Advanced Package Technology Development | — | Fab 10N/X, Singapore | 167d |
| Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding) | — | Boise, ID - Main Site | 41d |
| Process Engineer, APTD | — | Boise, ID - Main Site | 41d |
| Principal ASIC Design Engineer | — | Boise, ID - Main Site | 41d |
| Logistics Security Program Manager, Europe, Middle East, and Africa (EMEA) Region | — | Manassas, VA - Fab 6 | 40d |
| Sr Engineer, Process Development, Cell Film , Advance NAND | — | Fab 10N/X, Singapore | 167d |
| Senior/Principal Dry Etch Engineer | — | Boise, ID - Main Site | 167d |
| ID Construction Quality Assurance Lead | — | Boise, ID - ID1 | 40d |
| Facilities Electrical Coordinator | — | Boise, ID - ID1 | 40d |
| Senior Engineer, Global Facilities - Chem | — | Boise, ID - Main Site | 40d |
| Sr. Engineer - Water System Operation | — | Sanand - 303A - AT/SSD/MOD, India | 100d |
| Senior Engineer - Analog Design | — | Bengaluru, India | 100d |
| Senior DRAM RTL design engineer | — | Hyderabad - Phoenix Aquila, India | 100d |
| Front End Central Product Integration (FE cPIE) MTS (FE) | — | Boise, ID - ID1 | 167d |
| Senior Engineer – Process Development, Wet, NAND | — | Fab 10N/X, Singapore | 167d |
| Process Integration Lead- IJOP | — | Taichung - Fab 16, Taiwan | 167d |
| Front End Central Product Integration (FE cPIE) Principal Engineer/Senior Manager | — | Fab 10A, Singapore | 167d |
| Senior Member of Technical Staff (SMTS) – Process Development, Dry Etch, NAND | — | Fab 10N/X, Singapore | 167d |
| Distinguished Member of Technical Staff (DMTS) – Process Development, CMP, NAND | — | Fab 10N/X, Singapore | 167d |
| Senior/Staff Engineer, Frontend Labor Productivity & Data Engineering | — | Hiroshima - Fab 15, Japan | 167d |
| ENGINEER - F10 FAC CONTROL | — | Fab 10N/X, Singapore | 167d |
| Dry Etch Senior Engineer, Advance NAND | — | Fab 10N/X, Singapore | 167d |
| Technologist - Contamination Control | — | Fab 10N/X, Singapore | 167d |
| Frontend Central Product Integration Engineering (CPIE) Engineer/ Senior Engineer | — | Fab 10A, Singapore | 167d |
| Micron Taiwan 跨領域轉職徵才招募專區 (桃園/苗栗/台中/台南) | — | Taichung - Fab 16, Taiwan | 167d |
| Semiconductor Principal Design Engineer | — | Tokyo, Japan | 167d |
| New Beginnings - Return to Work program! | — | Hyderabad - Phoenix Aquila, India | 167d |
| Engineer/Senior Engineer in Product Engineering, NAND Validation/Characterization | — | MSB, Singapore | 167d |
| Staff Engineer – Process Development, Dry Etch, NAND | — | Fab 10N/X, Singapore | 167d |
| Distinguished Member of Technical Staff (DMTS) – Process Development, Cell Film, NAND | — | Fab 10N/X, Singapore | 167d |
| Engineer, Firmware Development (SSD) | — | MSB, Singapore | 167d |
| Construction Controls Manager | — | Taichung - Fab 16, Taiwan | 167d |
| New College Grad - Metals/Films Process Development Engineer | — | Boise, ID - Main Site | 167d |
| Facilities Operations Technicians | — | Fab 10N/X, Singapore | 167d |
| Mechanical Engineer | — | Hiroshima - Fab 15, Japan | 167d |
| Senior Engineer, Process Development, CMP | — | Fab 10N/X, Singapore | 167d |
| Staff Process Engineer, APTD Bonding | — | Boise, ID - Main Site | 161d |
| Product Quality Assurance Engineer | — | MSB, Singapore | 131d |
| Staff/Principal Engineer - CMP Advanced NAND | — | Fab 10N/X, Singapore | 124d |
| PCVD ATE Process Manager | — | Boise, ID - ID1 | 119d |
| GFac South Asia Project Controller | — | Fab 10A, Singapore | 103d |
| Principal Analog Design Engineer, HBM | — | Richardson, TX | 71d |
| Senior Engineer - Standard Cell Design | — | Hyderabad - Phoenix Aquila, India | 107d |
| Engineer – PDE Process Control Systems | — | Hyderabad - Phoenix Aquila, India | 69d |
| Process QE Engineer - CSM FDC | — | Taichung - Fab 16, Taiwan | 65d |
| Senior Logistics specialist | — | Taichung - Fab 16, Taiwan | 62d |
| STAFF ENGINEER, TDT DRAM PI | — | Taichung - Fab 16, Taiwan | 55d |
| RDA.Metrology Equipment Maintenance Engineer | — | Taichung - Fab 16, Taiwan | 51d |
| Staff Engineer, FE Central Planning Strategic Program | — | Fab 10A, Singapore | 44d |
| 半導体製造 工程管理スタッフ（シフト勤務） | — | Hiroshima - Fab 15, Japan | 167d |
| Distinguished Member of Technical Staff (DMTS), NAND CELL FILM PROCESS | — | Fab 10N/X, Singapore | 167d |
| Solid-State Drive (SSD) Senior Failure Analysis Engineer | — | Hyderabad - Phoenix Aquila, India | 30d |
| Senior Test Process Engineering Manager | — | Sanand - 303A - AT/SSD/MOD, India | 30d |
| Senior/Staff Engineer - STPG PE SYSTEM | — | MSB, Singapore | 27d |
| Engineer, MTB PCE | — | Taichung - MTB, Taiwan | 24d |
| Facility engineer | — | Taichung - MTB, Taiwan | 24d |
| PRINCIPAL ENGINEER - PROCT ADT PEE REG E | — | Boise, ID - Main Site | 140d |
| Senior Engineer, Edge Systems Architecture | — | Hyderabad - Phoenix Aquila, India | 20d |
| Senior Engineer, Global Facilities Central Engineering, Construction - Chemical & Gas | — | Fab 10A, Singapore | 135d |
| EFA TECH | — | Taichung - MTB, Taiwan | 17d |
| Staff Engineer, ASIC Design Verification | — | Hyderabad - Phoenix Aquila, India | 15d |
| Principal Design Engineer | — | San Jose, CA | 15d |
| Intern - Semiconductor Global Category Supplier Management | — | San Jose, CA | 15d |
| Facility Water Operations Technician | — | Boise, ID - ID1 | 116d |
| IPDev_Analog_Design2027 | — | Hashimoto, Japan | 14d |
| Design Verification Engineer Intern | — | Jalisco, Mexico | 78d |
| Senior Process Mechanical Engineer | — | Clay, NY | 10d |
| Principal Design Automation Engineer | — | San Jose, CA | 105d |
| Apply now. India Campus Team! | — | Hyderabad - Phoenix Aquila, India | 10d |
| FE CPIE Transformative Staff/Senior Engineer | — | Taichung - Fab 16, Taiwan | 105d |
| FE GLOBAL PLN PRE MOR, SR Engineer | — | Boise, ID - Main Site | 8d |
| Global Facility Project Planning Engineer – Taiwan Yellow field & China Project Management | — | Taichung - Fab 16, Taiwan | 101d |
| Industrial Engineer | — | Jalisco, Mexico | 8d |
| Probe HBM application integration engineer | — | Taichung - TCP, Taiwan | 8d |
| Principal Engineer - Analog Design | — | Bengaluru, India | 100d |
| Global Quality Technical Program Manager | — | Fab 10A, Singapore | 100d |
| Senior Software Engineer - IT EA ERP | — | Hyderabad - Phoenix Aquila, India | 8d |
| NAND Designer / Layout | — | Tokyo, Japan | 8d |
| Principal Engineer - Validation | — | Bengaluru, India | 99d |
| SAP S4 Hana Product Manager – Procurement Transformation | — | Hyderabad - Phoenix Aquila, India | 138d |
| NAND Designer / Layout | — | Tokyo, Japan | 8d |
| Foundry PDK / Collateral Integration Engineer (CAD/EDA) | — | Richardson, TX | 146d |
| Staff/Senior PAC (Pump, Abatement, and Chiller) Engineer | — | Boise, ID - Main Site | 147d |
| NAND Designer / Layout | — | Tokyo, Japan | 8d |
| Data Center Capacity Planner | — | Boise, ID - Main Site | 94d |
| Senior Principal ER Advisor & Investigator – Japan | — | Hashimoto, Japan | 8d |
| Facilities Electrical Engineer | — | Tainan, Taiwan | 8d |
| Semiconductor Process Engineer - Photo | — | Albany, NY | 8d |
| Staff Revenue Operations Business Analyst | — | Boise, ID - Main Site | 98d |
| Metallization Equipment (Shift) Engineer | — | Tainan, Taiwan | 8d |
| Intern - Technical Program Manager, Program Management Office (PMO) | — | Boise, ID - Main Site | 8d |
| Engineer, Process and Equipment Engineering | — | Fab 10N/X, Singapore | 71d |
| IT System Engineer (Shift rotation) | — | Penang, Malaysia - Grande | 91d |
| OSINT Analyst - remote / Tel-Aviv | — | MIL - Israel Hadera - Home | 71d |
| Engineer, Metrology | — | Fab 10N/X, Singapore | 71d |
| Staff Engineer, SSD Validation | — | Longmont, CO | 167d |
| Senior Engineer CAD, Physical Verification | — | Jalisco, Mexico | 8d |
| Technician, WH | — | Miaoli - Tongluo, Taiwan | 8d |
| Sr Manager, Procurement Platform Excellence | — | Hyderabad - Phoenix Aquila, India | 71d |
| Manager - SMAI ETD | — | Taichung - AATT, Taiwan | 87d |
| Senior Engineer - NAND Cell Reliability | — | Fab 10N/X, Singapore | 71d |
| Senior SAP UI5 / Fiori Developer | — | Hyderabad - Phoenix Aquila, India | 8d |
| APTD Senior Data Scientist | — | MSB, Singapore | 8d |
| STAFF ANALYST - IT EA FINANCE | — | Hyderabad - Phoenix Aquila, India | 8d |
| Facilities Cost Engineer (OPEX) | — | Sanand - 303C - Facilities/Construction, India | 8d |
| PDK Management DTCO Engineer - TPG | — | Richardson, TX | 7d |
| GEL Site Lead | — | San Jose, CA | 84d |
| Corporate Finance Manager | — | Boise, ID - Main Site | 7d |
| Senior DRAM Systems Architecture | — | San Jose, CA | 84d |
| FP&A Manager | — | Boise, ID - Main Site | 7d |
| Manager, US Expansion EHS Program Manager | — | Boise, ID - ID1 | 84d |
| F10 Probe Automation Technician | — | Fab 10N/X, Singapore | 7d |
| Probe Process Technician | — | Fab 10N/X, Singapore | 7d |
| Equipment Technician | — | Penang, Malaysia - Grande | 7d |
| IT Engineer (Data Services) | — | Penang, Malaysia - Grande | 7d |
| Facility Engineer | — | Taichung - MTB, Taiwan | 7d |
| OMT Equipment (SHIFT) Engineer | — | Tainan, Taiwan | 70d |
| OCT CPEE SENIOR ENGINEER | — | Taichung - Fab 16, Taiwan | 70d |
| SR ENGINEER, MTB PI | — | Taichung - MTB, Taiwan | 7d |
| Quality Technician - SSD RMA Failure Analysis | — | Longmont-MAX- Office, CO | 7d |
| NVMQRA Solid State Drive (SSD) Quality and Reliability Engineer | — | Sanand - 303A - AT/SSD/MOD, India | 70d |
| SR. DATA SCIENTIST, SMART MFG & AI | — | Taichung - Fab 16, Taiwan | 70d |
| Change Management Engineer | — | Boise, ID - Main Site | 7d |
| Assistant General Counsel - Ventures & M&A | — | San Jose, CA | 6d |
| SENIOR PRODUCT OWNER, SMAI | — | Fab 10A, Singapore | 6d |
| DRAM and Emerging Memory Quality Engineer | — | Boise, ID - Main Site | 6d |
| SENIOR FAC TOOLS INSTALL& LAYOUT | — | Penang, Malaysia - Grande | 70d |
| Sr Engineer, APTD Data Integration | — | Taichung - Fab 16, Taiwan | 6d |
| FG Analyst | — | Sanand - 303A - AT/SSD/MOD, India | 6d |
| OMT Dry Etch MTS | — | Taichung - Fab 16, Taiwan | 6d |
| MGR, F16N WET SWC ME | — | Miaoli - Tongluo, Taiwan | 70d |
| Staff Engineer, NAND Product Engineering | — | Fab 10N/X, Singapore | 69d |
| Automation Equipment Technician | — | MSB, Singapore | 69d |
| SR PRINCIPAL GSM, FE PRO GLOBAL CAPITAL | — | Fab 10A, Singapore | 69d |
| PDT Lead for Architecture Projects | — | Boise, ID - Main Site | 69d |
| Technologist - QEM Quality Management System (QMS) | — | Fab 10N/X, Singapore | 167d |
| HIG HBM PE Principal Component Validation Engineer | — | Fab 10A, Singapore | 167d |
| Staff Engineer, Advanced Development Process and Equipment, Dry Etch | — | Hiroshima - Fab 15, Japan | 167d |
| ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI) | — | MSB, Singapore | 167d |
| US FE Expansion Planning Engineer | — | Boise, ID - ID1 | 167d |
| Staff Engineer, SSD Validation | — | Longmont, CO | 167d |
| Principal Engineer, Firmware Design | — | Hyderabad - Phoenix Aquila, India | 167d |
| Dry Etch - MTS, PD, Advance NAND | — | Fab 10N/X, Singapore | 167d |
| Sr Engineer, SPMO Construction | — | Fab 10N/X, Singapore | 161d |
| Engineer - QEM PQE Electrical Failure Analysis | — | Fab 10N/X, Singapore | 150d |
| RDA FAB Engineer | — | Taichung - Fab 16, Taiwan | 120d |
| ID1 EUV Photolithography Senior Process Engineer | — | Boise, ID - ID1 | 120d |
| Senior Engineer, Technology - AMAIS | — | Hyderabad - Phoenix Aquila, India | 120d |
| MGR, Tainan Photo Scanner Equipment | — | Tainan, Taiwan | 120d |
| Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory | — | Fab 10A, Singapore | 167d |
| New College Grad - Photolithography Process Engineer | — | Boise, ID - ID1 | 167d |
| Senior Scanner Metrology Engineer | — | Boise, ID - ID1 | 167d |
| Senior Memory Circuit Design Verification Engineer | — | Hyderabad - Phoenix Aquila, India | 167d |
| Staff/Principal Capital Supplier Manager | — | Hiroshima - Fab 15, Japan | 150d |
| Principal Engineer, Frontend Organizations Central Team, Wet Process | — | Hiroshima - Fab 15, Japan | 139d |
| Director, Global Facilities & Construction, South Asia | — | Fab 10A, Singapore | 116d |
| 【立即應徵 Apply Now! 】2026 Autumn Campus Hiring 秋季校園徵才專區 | — | Taichung - Fab 16, Taiwan | 107d |
| Technician Apprentice | — | Sanand - 303A - AT/SSD/MOD, India | 97d |
| Equipment Technician (AMHS-Automated Material Handling System) (Manassas) | — | Manassas, VA - Fab 6 | 93d |
| Director of Hyperscale Sales | — | Seattle, WA | 153d |
| DRAM Device & Process Modeling Engineer | — | Boise, ID - Main Site | 84d |
| Principal Engineer, Films/Diffusion - Procurement and Operations Central Team Advanced Development | — | Hiroshima - Fab 15, Japan | 142d |
| DRAM Process Integration Engineer | — | Boise, ID - Main Site | 167d |
| DRAM Device & Cell Technology Engineer | — | Boise, ID - Main Site | 140d |
| EDE-SG Equipment Development Senior Engineer/Engineer (Dry Etch) | — | Fab 10N/X, Singapore | 167d |
| Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) | — | Fab 10A, Singapore | 140d |
| Staff/Senior Pump, Abatement, and Chiller Engineer | — | Hiroshima - Fab 15, Japan | 146d |
| Senior/Staff Program Manager - Sustainability Operations | — | Fab 10A, Singapore | 132d |
| ENGINEER - FAC TOOL INSTALL | — | Fab 10A, Singapore | 125d |